Toshio Enami: search on Z-Library

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1

REE-bearing epidote from Sanbagawa pelitic schists, central Shikoku, Japan.

Sakai, Chihiro, Higashino, Toshio, Enami, Masaki

Journal:

GEOCHEMICAL JOURNAL

Year:

1984

Language:

english

File:

PDF, 3.04 MB

english, 1984

2

Forced Discharge Dispersion by Dot-Matrix Method

Naotake Mohri, Katsushi Furutani, Kazuhisa Shirai, Toshio Enami

Journal:

CIRP Annals - Manufacturing Technology

Year:

1997

Language:

english

File:

PDF, 672 KB

english, 1997

3

Three-dimensional shaping by dot-matrix electrical discharge machining

Katsushi Furutani, Toshio Enami, Naotake Mohri

Journal:

Precision Engineering

Year:

1997

Language:

english

File:

PDF, 675 KB

english, 1997

4

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Challenges and approaches of ultra-fine pitch Cu pillar assembly on organic substrate using wafer level underfill

Lim, Sharon Pei-Siang, Siow, Li Yan, Chai, Tai Chong, Rao, Vempati Srinivasa, Takeda, Kohei, Enami, Toshio, Koh, Chee Guan, Wang, XiangFeng, Sun, Hong Qi, Ando, Tomoyuki

Year:

2013

File:

PDF, 653 KB

2013

5

[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Evaluation of residual stress caused by flip-chip bonding process using piezo-resistor embedded test element group chips

Enami, Toshio, Nanami, Kyosuke, Horiuchi, Osamu, Han, Young-Gun, Tomokage, Hajime

Year:

2015

Language:

english

File:

PDF, 865 KB

english, 2015

6

[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Residual stress evaluation of flip-chip bonding with non-conductive films on organic substrate and silicon interposer by piezo-sensor embedded test element group chips

Enami, Toshio, Nanami, Kyosuke, Horiuchi, Osamu, Han, Young-Gun, Tomokage, Hajime

Year:

2015

Language:

english

File:

PDF, 916 KB

english, 2015

7

[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Evaluation of relationship between residual stress of ICs and package warpage caused by flip-chip bonding

Enami, Toshio, Horiuchi, Osamu, Han, Young-Gun, Tomokage, Hajime

Year:

2016

Language:

english

File:

PDF, 910 KB

english, 2016

8

AMS 14C Dating of Iron Artifacts: Development and Application

Enami, Hiroki, Nakamura, Toshio, Oda, Hirotaka, Yamada, Tetsuya, Tsukamoto, Toshio

Journal:

Year:

2004

Language:

english

File:

PDF, 297 KB

english, 2004

9

3D Profile Generation by Dot-Matrix EDM (1st Report)

FURUTANI, Katsushi, ENAMI, Toshio, MOHRI, Naotake

Journal:

Journal of the Japan Society for Precision Engineering

Year:

1997

Language:

english

File:

PDF, 1.25 MB

english, 1997